Adaptive fault prediction analysis of computing components

ABSTRACT

Systems and methods for adaptive fault prediction analysis are described. In one embodiment, the system includes one or more computing components, and one or more hardware controllers. In some embodiments, the storage system includes a storage drive. At least one of the one or more hardware controllers is configured to analyze one or more tolerance limits of a first computing component among the plurality of computing components; calculate a failure metric of the first computing component based at least in part on the analysis of the one or more tolerance limits of the first computing component; analyze sensor data from the first computing component in real time; and update the failure metric based at least in part on the analyzing of the sensor data.

SUMMARY

The present disclosure is directed to methods and systems for adaptivefault prediction analysis. In some embodiments, the present systems andmethods may perform adaptive fault prediction analysis for one or morecomputing components.

A system for adaptive fault prediction analysis is described. In oneembodiment, the system may include one or more computing components, andone or more hardware controllers. In some embodiments, the system mayinclude a storage drive. At least one of the one or more hardwarecontrollers may be configured to analyze one or more tolerance limits ofa first computing component among the plurality of computing components;calculate a failure metric of the first computing component based atleast in part on the analysis of the one or more tolerance limits of thefirst computing component; analyze sensor data from the first computingcomponent in real time; and update the failure metric based at least inpart on the analyzing of the sensor data.

In some embodiments, the hardware controller may be configured to detecta failure of a second computing component among the plurality ofcomputing components. In some embodiments, the hardware controller maybe configured to identify a location of the first computing componentrelative to a location of the second computing component.

In some embodiments, the hardware controller may be configured todetermine whether the location of the first computing component relativeto the location of the second computing component satisfies a locationthreshold. In some embodiments, the hardware controller may beconfigured to update the failure metric of the first computing componentbased at least in part on how near the first computing component islocated relative to the second computing component.

Upon determining the first computing component is located directlyadjacent to the second computing component, the hardware controller mayupdate the failure metric of the first computing component a maximumamount allowed for failure in an adjacent component. In someembodiments, the hardware controller may be configured to update thefailure metric of the first computing component by an amount determinedbased at least in part on a component type associated with the firstcomponent, a component type associated with the second component, orboth.

In some cases, the one or more tolerance limits of the first computingcomponent may include at least one of component age, lifetimeutilization, accumulated operations, real-time component temperature,component temperature history, real-time component vibration, componentvibration history, real-time component electrical current, history ofcomponent electrical current, real-time component electrical voltage,history of component electrical voltage, or any combination thereof.

In some cases, the sensor data of the first computing component mayinclude at least one of an indication of an uncorrectable error, acommand timeout, a read or write error of a solid state drive, a read orwrite error of non-volatile memory device, a reallocated sector count, acurrent pending sector count, an offline uncorrectable sector count, orany combination thereof.

In some cases, analysis of the one or more tolerance limits of the firstcomputing component may include using machine learning to process theone or more tolerance limits of the first computing component. In somecases, the first computing component may include at least one of astorage drive, a storage drive within a storage enclosure enclosingmultiple storage drives, one or more main memory modules, one or moreprocessors, or any combination thereof.

An apparatus for adaptive fault prediction analysis is also described.In one embodiment, the apparatus may include a processor, memory inelectronic communication with the processor, and instructions stored inthe memory, the instructions being executable by the processor toanalyze one or more tolerance limits of a first computing componentamong the plurality of computing components; calculate a failure metricof the first computing component based at least in part on the analysisof the one or more tolerance limits of the first computing component;analyze sensor data from the first computing component in real time; andupdate the failure metric based at least in part on the analyzing of thesensor data.

A method for adaptive fault prediction analysis is also described. Inone embodiment, the method may include analyzing one or more tolerancelimits of a first computing component among the plurality of computingcomponents; calculating a failure metric of the first computingcomponent based at least in part on the analysis of the one or moretolerance limits of the first computing component; analyzing sensor datafrom the first computing component in real time; and updating thefailure metric based at least in part on the analyzing of the sensordata.

The foregoing has outlined rather broadly the features and technicaladvantages of examples according to this disclosure so that thefollowing detailed description may be better understood. Additionalfeatures and advantages will be described below. The conception andspecific examples disclosed may be readily utilized as a basis formodifying or designing other structures for carrying out the samepurposes of the present disclosure. Such equivalent constructions do notdepart from the scope of the appended claims. Characteristics of theconcepts disclosed herein, including their organization and method ofoperation, together with associated advantages will be better understoodfrom the following description when considered in connection with theaccompanying figures. Each of the figures is provided for the purpose ofillustration and description only, and not as a definition of the limitsof the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

A further understanding of the nature and advantages of the presentdisclosure may be realized by reference to the following drawings. Inthe appended figures, similar components or features may have the samereference label. Further, various components of the same type may bedistinguished by following a first reference label with a dash and asecond label that may distinguish among the similar components. However,features discussed for various components, including those having a dashand a second reference label, apply to other similar components. If onlythe first reference label is used in the specification, the descriptionis applicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

FIG. 1 is a block diagram of an example of a system in accordance withvarious embodiments;

FIG. 2 shows a block diagram of a device in accordance with variousaspects of this disclosure;

FIG. 3 shows a block diagram of one or more modules in accordance withvarious aspects of this disclosure;

FIG. 4 shows a diagram of a system in accordance with various aspects ofthis disclosure;

FIG. 5 shows one embodiment of an environment in accordance with variousaspects of this disclosure;

FIG. 6 is a flow chart illustrating an example of a method in accordancewith various aspects of this disclosure; and

FIG. 7 is a flow chart illustrating an example of a method in accordancewith various aspects of this disclosure.

DETAILED DESCRIPTION

The following relates generally to adaptive fault prediction analysis.In one embodiment, the present systems and methods may include anadaptive method to predict failures of computing components such asstorage drives, processors, memory modules, etc., installed in computingdevices and/or computing systems such as storage systems. Conventionalsystems predict component failure by only querying a component on aperiodic basis. However, the conventional methods inaccurately modeland/or predict component failure. Accordingly, a need exists to improvethe accuracy of predicting component failure, as the accuracy of suchpredictions affects warranty and spare unit strategies, and ultimately,a bottom-line of certain components.

The present systems and methods include an adaptive, multi-pronged andmulti-dimensional approach to predicting component failure. The presentsystems and methods include additional sources of data that theconventional methods do not consider. Also, the present systems andmethods perform a time-based and/or incident-based analysis as well asspatial or n-dimensional analysis, where n may be one or moredimensions. Additionally, the present systems and methods may includeuse of at least one of machine learning, deep learning, analytics, orany combination thereof to learn prediction indicators over time, andevolve with incoming data.

In one embodiment, the present systems and methods implements athree-stage decision engine to generate, modify, update, and output afailure metric for each monitored component. The present systems andmethods may include using the failure metrics as inputs to aninput/output (I/O) stack running on a failure prediction analysisengine. In some embodiments, the failure prediction analysis engine mayinclude tuneable, learning-based algorithms running on the I/O stack. Insome cases, the failure prediction analysis engine may include and/oroperate in conjunction with a management controller (MC), storagecontroller (SC), and/or host system associated with the monitoredcomponents. Additionally or alternatively, the failure predictionanalysis engine may include and/or operate in conjunction with anenclosure management subsystem (EMS) control process executed by astorage enclosure processor (SEP) and/or expander backplane (e.g.,microcontroller on a backplane of a storage enclosure). In some cases,the failure prediction analysis engine may be configured to takeappropriate control and/or preventive management actions.

The benefits of the present systems and methods include increasedcomponent and system reliability, reduced bottom-line costs forcomponents and systems containing the components, reduced warrantyclaims against components and systems affected by component failures,and optimized over-provisioning of computer related components includingbut not limited to storage-based components.

In some cases, the failure prediction analysis engine may include aninput block, a three-stage decision engine block, and an output block.In some cases, the failure prediction analysis engine may apply apredetermined weight to one or more inputs received at the input block.In some cases, the failure prediction analysis engine may apply apredetermined weight to an input based at least in part on the type ofinput. In some cases, the inputs may be referred to collectively astolerance limits.

In some embodiments, the one or more inputs may include knowledge basedata. The knowledge base data may include a database of failure factorsfor each particular component based on component type. In some cases,the knowledge based data may be referred to as failure factors. As oneexample, failure factors of a storage-based component may include atleast one of component age (e.g., a manufacturing date retrieved fromcomponent firmware), component lifetime utilization (e.g., accumulatedoperations such as read/writes of a storage-based component), componentoperational environment (e.g., tolerance limits associated withcomponent temperature, component vibration, component electricalcurrent, component electrical voltage, etc.), component mean time beforefailure, component annualized failure rate, or any combination thereof.

In some cases, the failure factors may include data or device statusinformation obtained from monitoring the component. For example, withstorage-based components the failure factors may include at least one ofreallocated sector count; reported uncorrectable errors; commandtimeout; current pending sector count; offline uncorrectable sectorcount; or any combination thereof. In some cases, the failure factorsmay include enclosure data from enclosure management sub-system (EMS).The EMS data may include at least one of topological data, mechanicaldata, or electrical data, or any combination thereof. The topologicaldata may include disk-to-bay-slot mappings, 2D spatial location ofstorage drives in an enclosure, etc. The mechanical data may includezone-wise temperatures (e.g., zone-wise temperatures of disk-bay-slots),airflow (e.g., pulse code modulation of fan speed readings, etc.),component vibration readings, and so forth. The electrical data mayinclude enclosure rail voltages, enclosure rail currents, storage drivevoltages, storage drive currents, etc.

In one embodiment, the failure factor inputs may be analyzed by thefailure prediction analysis engine. In some cases, the failureprediction analysis engine may output a performance failure rank (PFR).The PFR may also be referred to as a failure metric. In some cases, thefailure prediction analysis engine may generate a PFR for each monitoredcomponent. In some embodiments, the PFR may be graded on a scale such asfrom 1 to 10. In one example, a PFR of 1 may indicate a lowest chance offailure, and a PFR of 10 may indicate a highest chance of failure. A PFRin the range from 7 to 10 may be considered a high PFR; a PFR in therange from 4 to 6 may be considered a medium PFR; and a PFR from 1 to 3may be considered a low PFR. Alternatively, a PFR of 1 may indicate ahighest chance of failure, and a PFR of 10 may indicate a lowest chanceof failure.

In one example, the failure prediction analysis engine may compute a PFRfor each monitored component using failure factors as inputs. In somecases, at least one of the failure factors is associated with apredetermined threshold. In some embodiments, the failure predictionanalysis engine may update or modify at least one of the PFRs in realtime based at least in part on predetermined weighted combinations offailure attributes including but not limited to sensor data (e.g.,sensor data from sensors associated with the monitored components, EMSdata, etc.). In some cases, the PFRs, including updated and non-updatedPFRs, may be used as soft/hard threshold inputs to the I/O stack of thefailure prediction analysis engine. In some cases, the I/O stack may usevarious component utilization and/or data-placement decisions based onthe PFR values. In one example, a relatively high PFR for a particularcomponent may result in the present systems and methods being instructedby the failure prediction analysis engine to utilize the particularcomponent less than normally due to the perceived failure risk. Inanother example, a high or medium PFR of a storage component (e.g., astorage drive) may trigger firmware of the storage component toprioritize an unstable sector remapping. In another example, the failureprediction analysis engine may instruct EMS to offline a component witha relatively high PFR. In another example, the failure predictionanalysis engine may instruct EMS to implement a remanufacturing orfactory resetting of a component with a relatively high PFR.

In one embodiment, the failure prediction analysis engine may correlatea component's PFR with environmental data from a spatial zone and/orrelative location associated with a particular component and othercomponents. When a component is flagged with a relatively high PFR, thefailure factors, sensor data, and/or EMS data may indicate anassociation with environmental factors in the failing or predictedfailing of the component. As a result, the relatively high PFR of thecomponent may indicate a risk of failure among neighbouring components.In one embodiment, the failure prediction analysis engine may generate arisk neighbourhood of the high-PFR component. In some cases, the riskneighbourhood may include an n-dimensional risk neighbourhood, where nmay be 1 or more dimensions. In some cases, a radius or extent of therisk-neighbourhood may be proportional (e.g., linearly proportional,non-linearly proportional, log-linearly proportional, etc.) to thehigh-PFR component.

In some cases, the failure prediction analysis engine may take remedialmeasures for the components within the risk neighbourhood, by adjustingthe respective PFRs by a predetermined amount (e.g., a percentageadjustment of the component's current PFR, a predetermined fixed amountadjustment, etc.). In one example, the PFRs of components within therisk neighbourhood may be adjusted according to a PFR-adjustment-delta.In some cases, the PFR-adjustment-delta may include a bell-shaped curvewith regards to the radial proximity between the high-PFR component andcomponents within the risk neighbourhood where the closer the componentthe greater the adjustment. Additionally or alternatively, thePFR-adjustment-delta may include a Gaussian fall-off with regards to theradial proximity between the high-PFR component and components withinthe risk neighbourhood. In one example, the failure prediction analysisengine may instruct EMS to take appropriate actions and/or decisions toaddress the high environmental-based PFRs such as but not limited toincreasing a fan speed, controlled spin-down, proportionately decreasingor limiting use of computing components.

In one embodiment, the failure prediction analysis engine continuallyupdates individual PFRs as well as associated risk neighbourhoods basedon input data (e.g., failure factors, time data, incident data, sensordata, spatial data, etc.). In some cases, calculated PFR values may beused as soft/hard threshold inputs to the I/O stack in the failureprediction analysis. Thus, calculated PFR values may be used as in afeedback loop to further enhance the calculation of PFR values.

In one embodiment, a first stage may include taking in failure factorsas input. In some cases, the input may include knowledge baseinformation (e.g., tolerances of components provided by componentvendors, etc.). The input data may include monitored component data andcurrent status of the monitored components (e.g., component age,operation counts for a given component, current component temperature,etc.). In some cases, the collected inputs may be analyzed. The analysismay include passing the information through a decision tree such as butnot limited to a classification tree, a regression tree, a boosteddecision tree, or any combination thereof. The decision tree mayimplement a tree-like graph, which implements conditional controlstatements suitable for mapping the knowledge base onto a flowchart-likestructure.

A second stage of the present systems and methods takes in currentdevice conditions and/or EMS data as inputs. The PFRs may be updatedbased on analysis of the current device conditions and/or EMS data. Insome cases, the current device conditions and/or EMS data may beanalyzed using a directed acyclic graph (DAG) such as but not limited toa probabilistic Bayesian Network, a Markov network, another similarstructured learning model, or any combination thereof. The second stagemay be configured to update a belief/confidence in the calculated PFRsbased on periodic inputs and event occurrences.

A third stage of the present systems and methods includes correlatinghigh PFRs of failed/failing components from the second stage withenvironmental data (e.g., EMS data) to build a n-dimensional riskneighbourhood, where n may be one or more. The third stage may usereinforcement learning to analyze data (e.g., environmental data,existing PFRs, etc.). In some cases, the third stage may includemultiple “agents” that take one or more actions. In some cases, theseactions may affect/maximize a cumulative reward system, and hence maymap naturally to a group/cluster of adjacent components surrounding afailed/failing component.

FIG. 1 is a block diagram illustrating one embodiment of an environment100 in which the present systems and methods may be implemented. Theenvironment may include device 105 and storage media 110. The storagemedia 110 may include any combination of hard disk drives, solid statedrives, and hybrid drives that include both hard disk and solid statedrives. In some embodiment, the storage media 110 may include shingledmagnetic recording (SMR) storage drives. In some embodiments, thesystems and methods described herein may be performed on a single devicesuch as device 105. In some cases, the methods described herein may beperformed on multiple storage devices or a network of storage devicessuch a cloud storage system and/or a distributed storage system.Examples of device 105 include a storage server, a storage enclosure, astorage controller, storage drives in a distributed storage system,storage drives on a cloud storage system, storage devices on personalcomputing devices, storage devices on a server, or any combinationthereof. In some configurations, device 105 may include fault predictionmodule 130. In one example, the device 105 may be coupled to storagemedia 110. In some embodiments, device 105 and storage media 110 may becomponents of flash memory or a solid state drive and/or another type ofstorage drive. Alternatively, device 105 may be a component of a host ofthe storage media 110 such as an operating system, host hardware system,or any combination thereof.

In one embodiment, device 105 may be a computing device with one or moreprocessors, memory, and/or one or more storage devices. In some cases,device 105 may include a wireless storage device. In some embodiments,device 105 may include a cloud drive for a home or office setting. Inone embodiment, device 105 may include a network device such as aswitch, router, access point, or any combination thereof. In oneexample, device 105 may be operable to receive data streams, storeand/or process data, and/or transmit data from, to, or in conjunctionwith one or more local and/or remote computing devices.

The device 105 may include a database. In some cases, the database maybe internal to device 105. In some embodiments, storage media 110 mayinclude a database. Additionally, or alternatively, device 105 mayinclude a wired and/or a wireless connection to an external database.Additionally, as described in further detail herein, software and/orfirmware (for example, stored in memory) may be executed on a processorof device 105. Such software and/or firmware executed on the processormay be operable to cause the device 105 to monitor, process, summarize,present, and/or send a signal associated with the operations describedherein.

In some embodiments, storage media 110 may connect to device 105 via oneor more networks. Examples of networks include cloud networks, localarea networks (LAN), wide area networks (WAN), virtual private networks(VPN), a personal area network, near-field communication (NFC), atelecommunications network, wireless networks (using 802.11, forexample), and cellular networks (using 4G and/or LTE, for example), orany combination thereof. In some configurations, the network may includethe Internet and/or an intranet. The device 105 may receive and/or sendsignals over a network via a wireless communication link. In someembodiments, a user may access the functions of device 105 via a localcomputing device, remote computing device, and/or network device. Forexample, in some embodiments, device 105 may include an application thatinterfaces with a user. In some cases, device 105 may include anapplication that interfaces with one or more functions of a networkdevice, remote computing device, and/or local computing device.

In one embodiment, the storage media 110 may be internal to device 105.As one example, device 105 may include a storage controller thatinterfaces with storage media of storage media 110. Fault predictionmodule 130 may predict a failure of computing components such as one ofone or more hardware controllers, one or more processors, one or moremain memory modules, one or more storage drives, one or more storageenclosure components (e.g., microcontrollers, processors, memory, powersupply units, enclosure management modules, cooling fans, backplaneconnectors, backplane components, etc.), or any combination thereof.

FIG. 2 shows a block diagram 200 of an apparatus 205 for use inelectronic communication, in accordance with various aspects of thisdisclosure. The apparatus 205 may be an example of one or more aspectsof device 105 described with reference to FIG. 1. The apparatus 205 mayinclude a drive controller 210, system buffer 215, host interface logic220, drive media 225, and fault prediction module 130-a. Each of thesecomponents may be in communication with each other and/or othercomponents directly and/or indirectly.

One or more of the components of the apparatus 205, individually orcollectively, may be implemented using one or more application-specificintegrated circuits (ASICs) adapted to perform some or all of theapplicable functions in hardware. Alternatively, the functions may beperformed by one or more other processing units (or cores), on one ormore integrated circuits. In other examples, other types of integratedcircuits may be used such as Structured/Platform ASICs, FieldProgrammable Gate Arrays (FPGAs), and other Semi-Custom ICs, which maybe programmed in any manner known in the art. The functions of eachmodule may also be implemented, in whole or in part, with instructionsembodied in memory formatted to be executed by one or more generaland/or application-specific processors.

In one embodiment, the drive controller 210 may include a processor 230,a buffer manager 235, and a media controller 240. The drive controller210 may process, via processor 230, read and write requests inconjunction with the host interface logic 220, the interface between theapparatus 205 and the host of apparatus 205. The system buffer 215 mayhold data temporarily for internal operations of apparatus 205. Forexample, a host may send data to apparatus 205 with a request to storethe data on the drive media 225. Drive media 225 may include one or moredisk platters, flash memory, any other form of non-volatile memory, orany combination thereof. The drive controller 210 may process therequest and store the received data in the drive media 225. In somecases, a portion of data stored in the drive media 225 may be copied tothe system buffer 215 and the processor 230 may process or modify thiscopy of data and/or perform an operation in relation to this copy ofdata held temporarily in the system buffer 215. In some cases, ECC unit245 may perform error correction on data stored in drive media 225.

In some embodiments, fault prediction module 130-a may include at leastone of one or more processors, one or more memory devices, one or morestorage devices, instructions executable by one or more processorsstored in one or more memory devices and/or storage devices, or anycombination thereof. Although depicted outside of drive controller 210,in some embodiments, fault prediction module 130-a may include software,firmware, and/or hardware located within drive controller 210 and/oroperated in conjunction with drive controller 210. For example, faultprediction module 130-a may include at least a portion of processor 230,buffer manager 235, and/or media controller 240. In one example, faultprediction module 130-a may include one or more instructions executed byprocessor 230, buffer manager 235, and/or media controller 240.

FIG. 3 shows a block diagram of fault prediction module 130-b. The faultprediction module 130-b may include one or more processors, memory,and/or one or more storage devices. The fault prediction module 130-bmay include analysis module 305, calculation module 310, and data module315. The fault prediction module 130-b may be one example of faultprediction module 130 of FIGS. 1 and/or 2. Each of these components maybe in communication with each other.

In one embodiment, failure prediction module 130-b may be configured topredict the failure of one or more computing components. In oneembodiment, failure prediction module 130-b may be part of a storagesystem. The storage system may include a plurality of computingcomponents and a hardware controller. In some cases, the plurality ofcomputing components may include the hardware controller. Additionallyor alternatively, the plurality of computing components may include atleast one of one or more hardware controllers, one or more processors,one or more main memory modules, one or more storage drives, one or morestorage enclosure components (e.g., microcontrollers, processors,memory, power supply units, enclosure management modules, cooling fans,backplane connectors, backplane components, etc.), or any combinationthereof.

In some embodiments, the hardware controller may include one or morestorage controllers in a storage drive, one or more storage controllersin a storage server, one or more storage controllers in a storageenclosure, or any combination thereof. In some cases, the hardwarecontroller may include one or more processors of a host associated witha computing system and/or storage system. In some examples, the host mayinclude a hardware machine host such as a server, desktop computer,laptop, mobile computing device, etc., or a software machine host suchas a Virtual Machine (VM), a container, or some similar softwarecontainerization platform. Additionally or alternatively, the host mayinclude an operating system and/or firmware code.

In one embodiment, analysis module 305 may be configured to analyze oneor more tolerance limits of a first computing component among theplurality of computing components. In one embodiment, calculation module310 may be configured to calculate a failure metric of the firstcomputing component based at least in part on the analysis of the one ormore tolerance limits of the first computing component by analysismodule 305. In some cases, the first computing component includes atleast one of a storage drive in a computing device such as a storageserver, a storage drive within a storage enclosure enclosing multiplestorage drives, one or more main memory modules, one or more processors,or any combination thereof. In some cases, the plurality of computingcomponents may be components of a storage server, components of astorage enclosure, components of a host machine of the storageenclosure, or any combination thereof.

In some cases, the one or more tolerance limits of the first computingcomponent may include at least one of component age, lifetimeutilization, accumulated operations, real-time component temperature,component temperature history, real-time component vibration, componentvibration history, real-time component electrical current, history ofcomponent electrical current, real-time component electrical voltage,history of component electrical voltage, or any combination thereof. Thelifetime utilization and/or accumulated operations may includeaccumulated data read and/or data writes over a lifetime of a storagedrive. In some cases, component electrical current may be an electricalcurrent supplied to at least one of the computing components, anelectrical current stored by at least one of the computing components,an electrical current generated by at least one of the computingcomponents, or any combination thereof.

In some cases, analysis of the one or more tolerance limits of the firstcomputing component may include using machine learning to process theone or more tolerance limits of the first computing component. In somecases, using the machine learning may include using a decision tree orboosted decision tree to analyze the one or more tolerance limits of thefirst computing component.

In some embodiments, analysis module 305 may be configured to analyzesensor data from the first computing component in real time. In oneembodiment, data module 315 may be configured to update the failuremetric based at least in part on the analyzing of the sensor data by theanalysis module 305.

In some cases, the failure attributes such as but not limited to sensordata of the first computing component may include at least one of anindication of an uncorrectable error, an error in a solid state drive ornon-volatile memory device (e.g., write error, read error, flash memoryerror, etc.), a command timeout, a reallocated sector count, a currentpending sector count, an offline uncorrectable sector count, or anycombination thereof.

In one embodiment, analysis module 305 may be configured to detect afailure of a second computing component among the plurality of computingcomponents. In some embodiments, analysis module 305 may be configuredto identify a location of the first computing component relative to alocation of the second computing component. For example, the first andsecond computing components may be located in the same enclosure (e.g.,computing components in a storage enclosure, computing components in aserver enclosure, computing components in a desktop enclosure, etc.).

In some embodiments, analysis module 305 may be configured to determinewhether the location of the first computing component relative to thelocation of the second computing component satisfies a locationthreshold. In some examples, data module 315 may be configured to updatethe failure metric of the first computing component based at least inpart on how near the first computing component is located relative tothe second computing component. In some embodiments, upon analysismodule 305 determining the first computing component is located directlyadjacent to the second computing component, data module 315 may beconfigured to update the failure metric of the first computing componenta maximum amount allowed for failure in an adjacent component. Forexample, when the second computing component is directly adjacent to thefirst computing component (e.g., no component between the first andsecond computing components), then the failure metric of the firstcomputing component may be adjusted by a maximum amount; two away by anamount less than the maximum amount, and so forth. As one example, whenthe first computing component is directly adjacent to the secondcomputing component the failure metric of the first computing componentmay be adjusted by 10% (e.g., 10% increment or 10% decrement of failuremetric); when the first computing component is two away from the secondcomputing component (e.g., a third computing component between the firstand second computing components) then the failure metric of the firstcomputing component may be adjusted by 5%; when the first computingcomponent is three away from the second computing component (e.g., thirdand fourth computing components between the first and second computingcomponents) then the failure metric of the first computing component maybe adjusted by 1%; when the first computing component is four away fromthe second computing component (e.g., third, fourth, and fifth computingcomponent between the first and second computing components) then thefailure metric of the first computing component may be adjusted by 0%,etc. In some cases, the failure metric may be adjusted by a fixed amount(e.g., 3 point adjustment for directly adjacent, 2 point adjustment fortwo away, 1 point adjustment for three away, etc.).

In some embodiments, data module 315 may be configured to update thefailure metric of the first computing component by an amount determinedbased at least in part on a component type associated with the firstcomponent, a component type associated with the second component, orboth.

FIG. 4 shows a system 400 for adaptive fault prediction analysis, inaccordance with various examples. System 400 may include an apparatus405, which may be an example of any one of device 105 of FIG. 1 and/orapparatus 205 of FIG. 2.

Apparatus 405 may include components for bi-directional voice and/ordata communications including components for transmitting communicationsand components for receiving communications. For example, apparatus 405may communicate bi-directionally with one or more storage devices and/orclient systems. This bi-directional communication may be direct(apparatus 405 communicating directly with a storage system, forexample) and/or indirect (apparatus 405 communicating indirectly with aclient device through a server, for example).

Apparatus 405 may also include a processor module 445, and memory 410(including software/firmware code (SW) 415), an input/output controllermodule 420, a user interface module 425, a network adapter 430, and astorage adapter 435. The software/firmware code 415 may be one exampleof a software application executing on apparatus 405. The networkadapter 430 may communicate bi-directionally, via one or more wiredlinks and/or wireless links, with one or more networks and/or clientdevices. In some embodiments, network adapter 430 may provide a directconnection to a client device via a direct network link to the Internetvia a POP (point of presence). In some embodiments, network adapter 430of apparatus 405 may provide a connection using wireless techniques,including digital cellular telephone connection, Cellular Digital PacketData (CDPD) connection, digital satellite data connection, and/oranother connection. The apparatus 405 may include fault predictionmodule 130-c, which may perform the functions described above for thefault prediction module 130 of FIGS. 1, 2, and/or 3.

The signals associated with system 400 may include wirelesscommunication signals such as radio frequency, electromagnetics, localarea network (LAN), wide area network (WAN), virtual private network(VPN), wired network (such as but not limited to 802.3, etc.), wirelessnetwork (e.g., such as but not limited to 802.11, 802.15, etc.),cellular network (using any combination of 2G, 3G, long term evolution(LTE), 5G and/or any other available wireless standard, for example),and/or other signals. The network adapter 430 may enable one or more ofWWAN (GSM, CDMA, and WCDMA), WLAN (including BLUETOOTH® and Wi-Fi), WMAN(WiMAX) for mobile communications, antennas for Wireless Personal AreaNetwork (WPAN) applications (including RFID and UWB), or any combinationthereof.

One or more buses 440 may allow data communication between one or moreelements of apparatus 405 such as processor module 445, memory 410, I/Ocontroller module 420, user interface module 425, network adapter 430,and storage adapter 435, or any combination thereof.

The memory 410 may include random access memory (RAM), read only memory(ROM), flash memory, electrically erasable ROM (EEPROM), non-volatiledual in-line memory module (NVDIMMs), and/or other memory types. Thememory 410 may store computer-readable, computer-executablesoftware/firmware code 415 including instructions that, when executed,cause the processor module 445 to perform various functions described inthis disclosure. Alternatively, the software/firmware code 415 may notbe directly executable by the processor module 445 but may cause acomputer (when compiled and executed, for example) to perform functionsdescribed herein. Alternatively, the computer-readable,computer-executable software/firmware code 415 may not be directlyexecutable by the processor module 445, but may be configured to cause acomputer, when compiled and executed, to perform functions describedherein. The processor module 445 may include an intelligent hardwaredevice, for example, a central processing unit (CPU), a microcontroller,an application-specific integrated circuit (ASIC), field programmablegate array (FPGA), or any combination thereof.

In some embodiments, the memory 410 may contain, among other things, theBasic Input-Output system (BIOS) which may control basic hardware and/orsoftware operation such as the interaction with peripheral components ordevices. For example, at least a portion of the fault prediction module130-c to implement the present systems and methods may be stored withinthe system memory 410. Applications resident with system 400 aregenerally stored on and accessed via a non-transitory computer readablemedium, such as a hard disk drive or other storage medium. Additionally,applications can be in the form of electronic signals modulated inaccordance with the application and data communication technology whenaccessed via a network interface such as network adapter 430.

Many other devices and/or subsystems may be connected to and/or includedas one or more elements of system 400 (for example, a personal computingdevice, mobile computing device, smart phone, server, internet-connecteddevice, cellular radio module, or any combination thereof). In someembodiments, all of the elements shown in FIG. 4 need not be present topractice the present systems and methods. The devices and subsystems canbe interconnected in different ways from that shown in FIG. 4. In someembodiments, an aspect of some operation of a system, such as that shownin FIG. 4, may be readily known in the art and are not discussed indetail in this application. Code to implement the present disclosure canbe stored in a non-transitory computer-readable medium such as one ormore of system memory 410 or other memory. The operating system providedon I/O controller module 420 may be a mobile device operating system, adesktop/laptop operating system, a Real Time Operating System (RTOS), oranother known operating system.

The I/O controller module 420 may operate in conjunction with networkadapter 430 and/or storage adapter 435. The network adapter 430 mayenable apparatus 405 with the ability to communicate with client devicessuch as device 105 of FIG. 1, and/or other devices over a communicationnetwork. Network adapter 430 may provide wired and/or wireless networkconnections. In some cases, network adapter 430 may include an Ethernetadapter or Fibre Channel adapter. Storage adapter 435 may enableapparatus 405 to access one or more data storage devices such as storagedevice 110. The one or more data storage devices may include two or moredata tiers each. The storage adapter 435 may include one or more of anEthernet adapter, a Fibre Channel adapter, Fibre Channel Protocol (FCP)adapter, a SCSI adapter, and iSCSI protocol adapter.

FIG. 5 shows an environment 500 for adaptive fault prediction analysis,in accordance with various examples. At least one aspect of environment500 may be implemented in conjunction with device 105 of FIG. 1,apparatus 205 of FIG. 2, and/or fault prediction module 130 depicted inFIGS. 1, 2, 3, and/or 4.

As depicted, environment 500 may include enclosure management sub-system505, host 510, storage enclosure 515, and fault prediction module 130-d.As shown, host 510 may include I/O stack 520. As illustrated, storageenclosure 515 may include storage drives 525. As shown, storage drives525 may include storage drives S1 to S12 as one example. Althoughenvironment 500 shows storage drives S1 to S12, it is understood thatstorage drive 525 may include less or more storage drives than thenumber shown. As illustrated, fault prediction module 130-d may includestorage device database 530, device tolerance analyzer 535, datacollector 540, data analyzer 545, accumulator 550, and environmentanalyzer 555.

In one embodiment, any one or a combination of the operations describedwith relation to environment 500 may be performed by or in conjunctionwith one or more processors and/or controllers of at least one of host510, storage enclosure 515, storage drives 525, or any combinationthereof.

In some cases, enclosure management sub-system 505 and/or faultprediction module 130-d may be part of host 510. Host 510 may include atleast one of a computing device, a memory device, mobile computingdevice, storage server, operating system, or any combination thereof.

In some embodiments, host 510 may be a host of storage enclosure 515. Inone embodiment, host 510 may include at least one of a managementcontroller to manage storage enclosure 515 and/or one or more of storagedrives 525, a storage controller to control storage enclosure 515 and/orone or more of storage drives 525, a host machine of storage enclosure515 and/or one or more of storage drives 525, a host operating system ofstorage enclosure 515 and/or one or more of storage drives 525, or anycombination thereof.

In one embodiment, storage device database 530 may include a database ofinformation about one or more monitored components. The one or moremonitored components may include storage enclosure 515 and/or storagedrives 525. In some embodiments, the information stored in storagedevice database 530 may include tolerance limits of one or moremonitored components. In some cases, the one or more tolerance limitsstored in storage device database 530 may include at least one ofcomponent age, lifetime utilization, accumulated operations, real-timecomponent temperature, component temperature history, real-timecomponent vibration, component vibration history, real-time componentelectrical current, history of component electrical current, real-timecomponent electrical voltage, history of component electrical voltage,or any combination thereof.

In one embodiment, device tolerance analyzer 535 may analyze thetolerance limits stored in storage device database 530 in conjunctionwith the monitoring of the one or more components. In some cases, devicetolerance analyzer 535 may query a component or information stored abouta component and then compare information resulting from the query withdevice information stored in storage device database 530. In some cases,device tolerance analyzer 535 may provide one or more analysis resultsto accumulator 550.

In one embodiment, data collector 540 may collect data from enclosuremanagement sub-system 505 and/or host 510. In some cases, data collector540 may provide the data collected from enclosure management sub-system505 and/or host 510 to data analyzer 545. In one example, data collector540 may collect failure factors, sensor data, and/or EMS data fromenclosure management sub-system 505 and/or host 510. As shown, storageenclosure 515 may send sensor data 560 to enclosure managementsub-system 505. Additionally or alternatively, storage enclosure 515 maysend device status information 565 and related failure factors obtainedfrom monitoring the component.

In one embodiment, inputs to data analyzer 545 may include an outputfrom data collector 540 and/or an output from accumulator 550. In oneembodiment, environment analyzer 555 may analyze environmentalinformation associated with the one or more monitored components. Theenvironmental information may include a location of a first componentand a location of a second component relative to the location of thefirst component. In some cases, the environmental information mayinclude component temperature, component vibration, component electricalcurrent, electrical voltage, etc. In some cases, the environmentinformation may include a temperature of a zone, where the zone includestwo or more components in the same system.

In some embodiments, inputs to accumulator 550 may include at least oneof analysis results from device tolerance analyzer 535, analysis resultsfrom environment analyzer 555, or analysis results from data analyzer545, or any combination thereof. Data analyzer 545 may receive an outputfrom accumulator 550 and generate failure metrics 580 (e.g., performancefailure rankings (PFRs)) based on the information received fromaccumulator 550. In one embodiment, host 510 may receive the failuremetrics 580 and modify the operation of storage enclosure 515 based onthe received failure metrics 580. As shown, enclosure managementsub-system 505 may send EMS triggers 570 to storage enclosure 515. Asillustrated, host 510 may send one or more control signals 575 toenclosure management sub-system 505. In one example, host 510 mayreceive failure metrics 580 from data analyzer 545, generate a controlsignal 575 based on the received failure metrics 580. Enclosuremanagement sub-system 505 may then generate a command and send thecommand as a EMS trigger 570 to storage enclosure 515 instructingstorage enclosure 515 to modify the operation of one or more of thestorage drives 525.

In one embodiment, accumulator 550 may receive failure metrics 580 as aninput. Accordingly, data analyzer 545 may receive the accumulatedinformation from accumulator 550, which may include a feedback loop offailure metrics 580 from data analyzer 545. In some cases, data analyzer545 may update the information in failure metrics 580 (e.g., update thePFRs) based on the feedback loop of failure metrics 580 inputted toaccumulator 550. In some embodiments, accumulator may sum inputsreceived from device tolerance analyzer 535, environment analyzer 555,and/or failure metrics 580 fed back to accumulator 550 from dataanalyzer 545. As shown, with the summing of inputs accumulator 550 maytreat an input from device tolerance analyzer 535 as a positive input,an input from environment analyzer 555 as a negative input, and failuremetrics 580 fed back to accumulator 550 from data analyzer 545 as anegative input.

In some embodiments, data analyzer 545 may update one or more PFRs infailure metrics 580 based on environmental information regarding storagedrives 525. For example, when fault prediction module 130-d determinesthat storage drive S2 has failed, then data analyzer 545 may update thePFR for storage drive S2. Additionally or alternatively, faultprediction module 130-d may update the PFRs for one or more storagedrives adjacent or relatively near storage drive S2. For example, basedon environmental information from environment analyzer 555, dataanalyzer 545 may determine that storage drives S1, S3, S4, S5, and S6are adjacent to storage drive S2. As a result, data analyzer 545 mayupdate the PFRs for S1, S3, S4, S5, and S6. In some cases, data analyzer545 may determine that S1 and S3 are laterally adjacent to S2; determinethat S5 is vertically adjacent to S2; and determine that S4 and S6 arediagonally adjacent to S2. Accordingly, data analyzer 545 may adjust thePFRs of S1 and S3 by a first value for being laterally adjacent; adjustPFRs of S5 by a second value for being vertically adjacent; and adjustPFRs of S4 and S6 by a third value for being diagonally adjacent, wherethe first, second, and third values differ from each other. Similarly,in some cases the PFRs of all two-away components (e.g., S8 where S5 isbetween S8 and S2) may be modified differently based on being laterallyadjacent, vertically adjacent, or diagonally adjacent. Alternatively,the PFRs of all directly adjacent components (S1, S3, S4, S5, and S6)may be adjusted by a first amount whether the components are linearlyadjacent, vertically adjacent or diagonally adjacent; and all two awaycomponents may be adjusted by a second amount different from the firstamount whether the components are linearly adjacent, vertically adjacentor diagonally adjacent, and so forth.

FIG. 6 is a flow chart illustrating an example of a method 600 foradaptive fault prediction analysis, in accordance with various aspectsof the present disclosure. One or more aspects of the method 600 may beimplemented in conjunction with device 105 of FIG. 1, apparatus 205 ofFIG. 2, and/or fault prediction module 130 depicted in FIGS. 1, 2, 3,and/or 4. In some examples, a backend server, computing device, and/orstorage device may execute one or more sets of codes to control thefunctional elements of the backend server, computing device, and/orstorage device to perform one or more of the functions described below.Additionally or alternatively, the backend server, computing device,and/or storage device may perform one or more of the functions describedbelow using special-purpose hardware.

At block 605, method 600 may include analyzing one or more tolerancelimits of a first computing component among the plurality of computingcomponents. At block 610, method 600 may include calculating a failuremetric of the first computing component based at least in part on theanalysis of the one or more tolerance limits of the first computingcomponent. At block 615, method 600 may include analyzing sensor datafrom the first computing component in real time. At block 620, method600 may include updating the failure metric based at least in part onthe analyzing of the sensor data.

The operation(s) at block 605-620 may be performed using the faultprediction module 130 described with reference to FIGS. 1-4 and/oranother module. Thus, the method 600 may provide for adaptive faultprediction analysis. It should be noted that the method 600 is just oneimplementation and that the operations of the method 600 may berearranged, omitted, and/or otherwise modified such that otherimplementations are possible and contemplated.

FIG. 7 is a flow chart illustrating an example of a method 700 foradaptive fault prediction analysis, in accordance with various aspectsof the present disclosure. One or more aspects of the method 700 may beimplemented in conjunction with device 105 of FIG. 1, apparatus 205 ofFIG. 2, and/or fault prediction module 130 depicted in FIGS. 1, 2, 3,and/or 4. In some examples, a backend server, computing device, and/orstorage device may execute one or more sets of codes to control thefunctional elements of the backend server, computing device, and/orstorage device to perform one or more of the functions described below.Additionally or alternatively, the backend server, computing device,and/or storage device may perform one or more of the functions describedbelow using special-purpose hardware.

At block 705, method 700 may include detecting a failure of a firstcomputing component among a plurality of computing components. At block710, method 700 may include identifying a location of a second computingcomponent relative to a location of the first computing component.

At block 715, method 700 may include determining whether a location ofthe second computing component is within a risk neighborhood of thefirst computing component. For example, method 700 may determine whetherthe first computing component is within a predetermined distance of thesecond computing component.

Upon determining the location of the second computing component iswithin the risk neighborhood, at block 720 method 700 may includeupdating the failure metric of the second computing component based atleast in part on how near the second computing component is locatedrelative to the first computing component.

Upon determining the location of the second computing component iswithin the risk neighborhood, at block 725 method 700 may includebypassing adjustment of the failure metric of the second computingcomponent based on the location of the second computing componentrelative to the first computing component.

The operations at blocks 705-725 may be performed using the faultprediction module 130 described with reference to FIGS. 1-4 and/oranother module. Thus, the method 700 may provide for adaptive faultprediction analysis. It should be noted that the method 700 is just oneimplementation and that the operations of the method 700 may berearranged, omitted, and/or otherwise modified such that otherimplementations are possible and contemplated.

In some examples, aspects from two or more of the methods 600 and 700may be combined and/or separated. It should be noted that the methods600 and 700 are just example implementations, and that the operations ofthe methods 600 and 700 may be rearranged and/or otherwise modified suchthat other implementations are possible.

The detailed description set forth above in connection with the appendeddrawings describes examples and does not represent the only instancesthat may be implemented or that are within the scope of the claims. Theterms “example” and “exemplary,” when used in this description, mean“serving as an example, instance, or illustration,” and not “preferred”or “advantageous over other examples.” The detailed description includesspecific details for the purpose of providing an understanding of thedescribed techniques. These techniques, however, may be practicedwithout these specific details. In some instances, known structures andapparatuses are shown in block diagram form in order to avoid obscuringthe concepts of the described examples.

Information and signals may be represented using any of a variety ofdifferent technologies and techniques. For example, data, instructions,commands, information, signals, bits, symbols, and chips that may bereferenced throughout the above description may be represented byvoltages, currents, electromagnetic waves, magnetic fields or particles,optical fields or particles, or any combination thereof.

The various illustrative blocks and components described in connectionwith this disclosure may be implemented or performed with ageneral-purpose processor, a digital signal processor (DSP), an ASIC, anFPGA or other programmable logic device, discrete gate or transistorlogic, discrete hardware components, or any combination thereof designedto perform the functions described herein. A general-purpose processormay be a microprocessor, but in the alternative, the processor may beany conventional processor, controller, microcontroller, and/or statemachine. A processor may also be implemented as a combination ofcomputing devices, for example, a combination of a DSP and amicroprocessor, multiple microprocessors, one or more microprocessors inconjunction with a DSP core, and/or any combination thereof.

The functions described herein may be implemented in hardware, softwareexecuted by a processor, firmware, or any combination thereof. Ifimplemented in software executed by a processor, the functions may bestored on or transmitted over as one or more instructions or code on acomputer-readable medium. Other examples and implementations are withinthe scope and spirit of the disclosure and appended claims. For example,due to the nature of software, functions described above can beimplemented using software executed by a processor, hardware, firmware,hardwiring, or combinations of any of these. Features implementingfunctions may also be physically located at various positions, includingbeing distributed such that portions of functions are implemented atdifferent physical locations.

As used herein, including in the claims, the term “and/or,” when used ina list of two or more items, means that any one of the listed items canbe employed by itself, or any combination of two or more of the listeditems can be employed. For example, if a composition is described ascontaining components A, B, and/or C, the composition can contain Aalone; B alone; C alone; A and B in combination; A and C in combination;B and C in combination; or A, B, and C in combination. Also, as usedherein, including in the claims, “or” as used in a list of items (forexample, a list of items prefaced by a phrase such as “at least one of”or “one or more of”) indicates a disjunctive list such that, forexample, a list of “at least one of A, B, or C” means A or B or C or ABor AC or BC or ABC, or A and B and C.

In addition, any disclosure of components contained within othercomponents or separate from other components should be consideredexemplary because multiple other architectures may potentially beimplemented to achieve the same functionality, including incorporatingall, most, and/or some elements as part of one or more unitarystructures and/or separate structures.

Computer-readable media includes both computer storage media andcommunication media including any medium that facilitates transfer of acomputer program from one place to another. A storage medium may be anyavailable medium that can be accessed by a general purpose or specialpurpose computer. By way of example, and not limitation,computer-readable media can comprise RAM, ROM, EEPROM, flash memory,CD-ROM, DVD, or other optical disk storage, magnetic disk storage orother magnetic storage devices, or any other medium that can be used tocarry or store desired program code means in the form of instructions ordata structures and that can be accessed by a general-purpose orspecial-purpose computer, or a general-purpose or special-purposeprocessor. Also, any connection is properly termed a computer-readablemedium. For example, if the software is transmitted from a website,server, or other remote source using a coaxial cable, fiber optic cable,twisted pair, digital subscriber line (DSL), or wireless technologiessuch as infrared, radio, and microwave, or any combination thereof, thenthe coaxial cable, fiber optic cable, twisted pair, DSL, or wirelesstechnologies such as infrared, radio, and/or microwave are included inthe definition of medium. Disk and disc, as used herein, include anycombination of compact disc (CD), laser disc, optical disc, digitalversatile disc (DVD), floppy disk and Blu-ray disc where disks usuallyreproduce data magnetically, while discs reproduce data optically withlasers. Combinations of the above are also included within the scope ofcomputer-readable media.

The previous description of the disclosure is provided to enable aperson skilled in the art to make or use the disclosure. Variousmodifications to the disclosure will be readily apparent to thoseskilled in the art, and the generic principles defined herein may beapplied to other variations without departing from the scope of thedisclosure. Thus, the disclosure is not to be limited to the examplesand designs described herein but is to be accorded the broadest scopeconsistent with the principles and novel features disclosed.

This disclosure may specifically apply to data security systemapplications. This disclosure may specifically apply to storage systemapplications. In some embodiments, the concepts, the technicaldescriptions, the features, the methods, the ideas, and/or thedescriptions may specifically apply to storage and/or data securitysystem applications. Distinct advantages of such systems for thesespecific applications are apparent from this disclosure.

The process parameters, actions, and steps described and/or illustratedin this disclosure are given by way of example only and can be varied asdesired. For example, while the steps illustrated and/or described maybe shown or discussed in a particular order, these steps do notnecessarily need to be performed in the order illustrated or discussed.The various exemplary methods described and/or illustrated here may alsoomit one or more of the steps described or illustrated here or includeadditional steps in addition to those disclosed.

Furthermore, while various embodiments have been described and/orillustrated here in the context of fully functional computing systems,one or more of these exemplary embodiments may be distributed as aprogram product in a variety of forms, regardless of the particular typeof computer-readable media used to actually carry out the distribution.The embodiments disclosed herein may also be implemented using softwaremodules that perform certain tasks. These software modules may includescript, batch, or other executable files that may be stored on acomputer-readable storage medium or in a computing system. In someembodiments, these software modules may permit and/or instruct acomputing system to perform one or more of the exemplary embodimentsdisclosed here.

This description, for purposes of explanation, has been described withreference to specific embodiments. The illustrative discussions above,however, are not intended to be exhaustive or limit the present systemsand methods to the precise forms discussed. Many modifications andvariations are possible in view of the above teachings. The embodimentswere chosen and described in order to explain the principles of thepresent systems and methods and their practical applications, to enableothers skilled in the art to utilize the present systems, apparatus, andmethods and various embodiments with various modifications as may besuited to the particular use contemplated.

What is claimed is:
 1. A system comprising: a plurality of computingcomponents; a hardware controller configured to: analyze one or moretolerance limits of a first computing component among the plurality ofcomputing components; calculate a failure metric of the first computingcomponent based at least in part on the analysis of the one or moretolerance limits of the first computing component; analyze sensor datafrom the first computing component in real time; determine that locationof the first computing component relative to location of the secondcomputing component satisfies a location threshold; and update thefailure metric based at least in part on the analyzing of the sensordata and in part on how near the first computing component is locatedrelative to a second computing component.
 2. The system of claim 1,wherein the hardware controller is further configured to: detect afailure of the second computing component among the plurality ofcomputing components.
 3. The system of claim 2, wherein the hardwarecontroller is further configured to: identify a location of the firstcomputing component relative to a location of the second computingcomponent.
 4. The system of claim 3, wherein the hardware controller isfurther configured to: determine that the first computing component islocated adjacent to the second computing component and in response,update the failure metric to a predetermined amount allowed for failurein an adjacent component.
 5. The system of claim 3, wherein the hardwarecontroller is further configured to: upon determining the firstcomputing component is located directly adjacent to the second computingcomponent, update the failure metric of the first computing component amaximum amount allowed for failure in an adjacent component.
 6. Thesystem of claim 2, wherein the hardware controller is further configuredto: update the failure metric of the first computing component by anamount determined based at least in part on a component type associatedwith the first computing component, a component type associated with thesecond computing component, or both.
 7. The system of claim 1, whereinthe one or more tolerance limits of the first computing componentincludes at least one of component age, lifetime utilization,accumulated operations, real-time component temperature, componenttemperature history, real-time component vibration, component vibrationhistory, real-time component electrical current, history of componentelectrical current, real-time component electrical voltage, history ofcomponent electrical voltage, or any combination thereof.
 8. The systemof claim 1, wherein the sensor data of the first computing componentincludes at least one of an indication of an uncorrectable error, acommand timeout, a read or write error of a solid state drive, a read orwrite error of non-volatile memory device, a reallocated sector count, acurrent pending sector count, an offline uncorrectable sector count, orany combination thereof.
 9. The system of claim 1, wherein analysis ofthe one or more tolerance limits of the first computing componentincludes using at least one of machine learning, deep learning,analytics, or any combination thereof, to process the one or moretolerance limits of the first computing component.
 10. The system ofclaim 1, wherein the first computing component includes at least one ofa storage drive, a storage drive within a storage enclosure enclosingmultiple storage drives, one or more main memory modules, one or moreprocessors, or any combination thereof.
 11. An apparatus comprising: ahardware controller configured to: analyze one or more tolerance limitsof a first computing component among a plurality of computingcomponents; calculate a failure metric of the first computing componentbased at least in part on the analysis of the one or more tolerancelimits of the first computing component; analyze sensor data from thefirst computing component in real time; determine that location of thefirst computing component relative to location of the second computingcomponent satisfies a location threshold; and update the failure metricbased at least in part on the analyzing of the sensor data and in parton how near the first computing component is located relative to asecond computing component; detect a failure of the second computingcomponent among the plurality of computing components.
 12. The apparatusof claim 11, wherein the hardware controller is further configured to:identify a location of the first computing component relative to alocation of the second computing component.
 13. The apparatus of claim12, wherein the hardware controller is further configured to: Determinethat the first computing component is located adjacent to the secondcomputing component and in response, update the failure metric to apredetermined amount allowed for failure in an adjacent component. 14.The apparatus of claim 12, wherein the hardware controller is furtherconfigured to: upon determining the first computing component is locateddirectly adjacent to the second computing component, update the failuremetric of the first computing component a maximum amount allowed forfailure in an adjacent component.
 15. The apparatus of claim 11, whereinthe hardware controller is further configured to: update the failuremetric of the first computing component by an amount determined based atleast in part on a component type associated with the first computingcomponent, a component type associated with the second computingcomponent, or both.
 16. The apparatus of claim 11, wherein the one ormore tolerance limits of the first computing component includes at leastone of component age, lifetime utilization, accumulated operations,real-time component temperature, component temperature history,real-time component vibration, component vibration history, real-timecomponent electrical current, history of component electrical current,real-time component electrical voltage, history of component electricalvoltage, or any combination thereof.
 17. The apparatus of claim 11,wherein the sensor data of the first computing component includes atleast one of an indication of an uncorrectable error, a command timeout,a read or write error of a solid state drive, a read or write error ofnon-volatile memory device, a reallocated sector count, a currentpending sector count, an offline uncorrectable sector count, or anycombination thereof.
 18. The apparatus of claim 11, wherein analysis ofthe one or more tolerance limits of the first computing componentincludes using at least one of machine learning, deep learning,analytics, or any combination thereof to process the one or moretolerance limits of the first computing component.
 19. A method ofpredicting failures of computing components within a computing systemcomprising: analyzing one or more tolerance limits of a first computingcomponent among a plurality of computing components in the computingsystem; calculating a failure metric of the first computing componentbased at least in part on the analysis of the one or more tolerancelimits of the first computing component; analyzing sensor data from thefirst computing component in real time, the sensor data including atleast one of an indication of an uncorrectable error, a command timeout,a reallocated sector count, a current pending sector count, an offlineuncorrectable sector count, or any combination thereof; determining thatlocation of the first computing component relative to location of thesecond computing component satisfies a location threshold; and updatingthe failure metric based at least in part on the analyzing of the sensordata and in part on how near the first computing component is locatedrelative to a second computing component.
 20. The method of claim 19,comprising: detecting a failure of the second computing component amongthe plurality of computing components.